High Density Fibreboard (HDF) and Chipboard Overlay Panel – Optimised for Underfloor Heating Systems

Enhance the efficiency and durability of your flooring system with the High Density Fibreboard (HDF) and Chipboard Overlay Panel—a premium solution designed for seamless integration with the Profloor Foil-Faced OSB Board in wet underfloor heating installations. Whether you're working on a new build or a retrofit project, this high-performance overlay panel ensures maximum heat transfer, structural stability, and long-term durability.

Key Features & Benefits

1. Superior Material Composition

• High-Density Fibreboard (HDF): Stronger and more rigid than MDF, HDF is crafted from compressed wood fibers, offering exceptional load-bearing capacity and longevity.
• Chipboard Core: Provides additional stability and strength, ensuring a solid foundation for various floor finishes.

2. Optimised for Underfloor Heating

• Enhanced Heat Transfer: The high-density composition allows for efficient and even heat distribution, improving energy efficiency and reducing heating costs.
• Low Thermal Resistance: Designed to maximise warmth retention, ensuring consistent and comfortable room temperatures.
• Protects Heating Pipes: Acts as a protective layer, safeguarding underfloor heating components from potential damage.

3. Low Build Height – Ideal for Retrofitting

• Slim Profile: The panel's low-profile design minimises floor height increase, making it an ideal choice for projects where space constraints are a concern.
• Perfect for Renovations: Whether upgrading an existing floor or installing a new heating system, this overlay panel seamlessly integrates into any space without major structural modifications.

4. Versatile Flooring Compatibility

• Smooth, Stable Surface: Provides a perfect base for a wide range of floor coverings, including:
• Vinyl
• Laminate
• Engineered wood
• Carpets (with appropriate underlay)
• Prevents Uneven Surfaces: Ensures a flawless installation by preventing floor warping or movement over time.

5. Easy & Hassle-Free Installation

• Pre-Marked Pipe Channels & Screw Positions: Makes alignment with the Profloor Foil-Faced OSB Board effortless.
• Lightweight & Easy to Cut: Can be customised to fit any room layout with minimal effort.
• Quick Fit, No Mess: Simple tongue-and-groove edges allow for secure, seamless connections.

Applications

• Residential & Commercial Properties: Perfect for homes, offices, retail spaces, and high-traffic areas.
• New Builds & Renovation Projects: Ensures optimal heat performance while maintaining flooring stability.
• Underfloor Heating Systems: Specifically designed to enhance efficiency and protect heating elements.

Technical Specifications

• Panel Size: 1200mm x 600mm
• Material: High-Density Fibreboard (HDF) & Chipboard
• Floor Compatibility: Vinyl, Laminate, Engineered Wood, Carpet
• Installation: Quick fit, Pre-marked screw positions

Why Choose the HDF & Chipboard Overlay Panel?

• Maximisses Energy Efficiency: Ensures even heat distribution for lower energy costs.
• Built for Durability: Long-lasting performance, even in high-traffic areas.
• Quick & Simple Installation: Saves time and labor costs during setup.
• Versatile & Adaptable: Compatible with various flooring finishes and underfloor heating systems.